Systems and methods for use of capacitive member to prevent chip fraud

ABSTRACT

Example embodiments of systems and methods for preventing chip fraud are provided. A chip fraud prevention system may comprise a device including a chip, wherein the chip is at least partially encompassed in a chip pocket. One or more connections may be communicatively coupled to one or more surfaces of the chip, and a capacitance member may be coupled to a surface of the chip. The capacitance member may comprise a known capacitance value and the chip may comprise a memory containing an applet, wherein the applet is configured to measure the capacitance value of the capacitance member.

FIELD OF THE INVENTION

The present disclosure relates to systems and methods for the use of acapacitive fraud prevention member in a device, such as a smartcard, andmore particularly, to systems and methods utilizing a fraud preventioncapacitive member to prevent chip fraud.

BACKGROUND

Removing a chip from one smartcard and inserting it into anothersmartcard or other device increases the risk of fraud. Moreover,conventional chip placement methods, such as methods that use smoothmilling patterns, are ineffective due to the ease of chip removal. Forexample, for smartcards having chips, there is a significant likelihoodof the removal of chips that are not securely positioned, such as byphysical removal or thermal removal, and these chips may then be subjectto re-implantation into another card or other device. As a consequence,smartcards having chips may be fraudulently manipulated, reprogrammed,and/or otherwise misused.

These and other deficiencies exist. Accordingly, there is a need for achip fraud prevention system that improves security, reduces the risk offraud, reduces cost, and increases durability.

SUMMARY

Aspects of the disclosed technology include systems and methods for theuse of a fraud prevention capacitive member containing for a card, suchas a smartcard. Various embodiments describe systems and methods forutilizing a fraud prevention capacitive member to prevent chip fraud.

Embodiments of the present disclosure provide a chip fraud preventionsystem comprising a device including a chip, the chip at least partiallyencompassed in a chip pocket; one or more connections communicativelycoupled to one or more surfaces of the chip; and a capacitance membercoupled to a surface of the chip, wherein the capacitance membercomprises a known capacitance value and wherein the chip comprises amemory containing an applet, the applet configured to measure thecapacitance value of the capacitance member.

Embodiments of the present disclosure provide a method of preventingchip fraud, the method comprising the steps of positioning a chip of adevice in a reservoir, the chip comprising a memory containing anapplet; communicatively coupling one or more components to a surface ofthe chip; and coupling a capacitance member to the surface of the chip,wherein the capacitance member is in data communication with the chipand comprises a capacitance value, and wherein the applet is configuredto detect the capacitance value of the capacitance member.

Embodiments of the present disclosure provide a contactless cardincluding a substrate layer, the contactless card comprising one or moreintegrated circuits positioned in one or more housings; one or moreconnections communicatively coupled to one or more surfaces of each ofthe one or more integrated circuits, and one or more capacitance memberscommunicatively coupled to one or more surfaces of each of the one ormore integrated circuits, wherein the capacitance members comprise aknown capacitance value based on the length and metal alloy of thecapacitance members.

Further features of the disclosed design, and the advantages offeredthereby, are explained in greater detail hereinafter with reference tospecific example embodiments illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an illustration of a card according to an example embodiment.

FIG. 1B is an illustration of a contact pad of a card according to anexample embodiment.

FIG. 2A is an illustration of a contact pad and a chip according to anexample embodiment.

FIG. 2B is an illustration of a contact pad and a chip according to anexample embodiment.

FIG. 2C is an illustration of a contact pad and a chip according to anexample embodiment.

FIG. 2D is an illustration of a contact pad and a chip according to anexample embodiment.

FIG. 2E is an illustration of a contact pad and a chip according to anexample embodiment.

FIG. 2F is an illustration of a contact pad and a chip according to anexample embodiment.

FIG. 3A is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3B is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3C is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3D is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3E is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3F is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3G is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 3H is an illustration of a cross-sectional view of a chip pocketand a chip according to an example embodiment.

FIG. 4A is an illustration of a cross-sectional view of a chip pocket, achip, and a capacitance member according to an example embodiment.

FIG. 4B is an illustration of a cross-sectional view of a chip pocket, achip, and a capacitance member according to an example embodiment.

FIG. 4C is an illustration of a cross-sectional view of a chip pocket, achip, and a capacitance member according to an example embodiment.

FIG. 4D is an illustration of a cross-sectional view of a chip pocket, achip, and a capacitance member according to an example embodiment.

FIG. 5 illustrates a method of making a card according to an exampleembodiment.

FIG. 6 illustrates a method of making a device with a capacitance memberaccording to an example embodiment.

FIG. 7 illustrates a schematic of one or more layers of the contactlesscard according to an example embodiment.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Systems and methods described herein are directed to improvingdurability for chip placement methods in a contactless card, includingsaw tooth milling pattern and other means of preventing removal of thechip described herein. As further described below, the saw tooth millingpattern promotes the success of adhesion of the chip to a chip pocket ofthe contactless card while also creating an uneven cutting process toprevent removal of the chip. As a consequence of this and the otherremoval prevention designs described herein, chip fraud is reduced oreliminated. In addition, manufacturing processes can be improved andproduction costs may be decreased. Further cost and resource savings maybe achieved through a decrease in fraud, including decreased needs forinvestigating and refunding fraudulent transactions, customer support,and replacing smartcards.

FIG. 1A illustrates one or more contactless cards 100, which maycomprise a payment card, such as a credit card, debit card, or giftcard, issued by a service provider 105 displayed on the front or back ofthe card 100. In some examples, the contactless card 100 is not relatedto a payment card, and may comprise, without limitation, anidentification card, a membership card, a data storage card, or othertype of card. In some examples, the payment card may comprise acontactless card, such as a dual interface contactless payment card, acontact card that requires physical contact with a card reader, or othertype of chip-based card. The card 100 may comprise a substrate 101,which may include a single layer or one or more laminated layerscomposed of plastics, metals, and other materials. Exemplary substratematerials include polyvinyl chloride, polyvinyl chloride acetate,acrylonitrile butadiene styrene, polycarbonate, polyesters, anodizedtitanium, palladium, gold, carbon, paper, and biodegradable materials.In some examples, the card 100 may have physical characteristicscompliant with the ID-1 format of the ISO/IEC 7810 standard, and thecard may otherwise be compliant with the ISO/IEC 14443 standard.However, it is understood that the card 100 according to the presentdisclosure may have different characteristics, and the presentdisclosure does not require a card to be implemented in a payment card.

The card 100 may comprise account number information 110 that may bedisplayed on the front and/or back of the card 100. The card 100 mayalso include identification information 115 displayed on the frontand/or back of the card 100, and a contact pad 120. In some examples,identification information 115 may comprise one or more of cardholdername and expiration date of the card 100. The contact pad 120 may beconfigured to establish contact with another communication device, suchas a user device, smart phone, laptop, desktop, or tablet computer. Thecard 100 may also include processing circuitry, antenna and othercomponents not shown in FIG. 1A. These components may be located behindthe contact pad 120 or elsewhere on the substrate 101. The card 100 mayalso include a magnetic strip or tape, which may be located on the backof the card (not shown in FIG. 1A).

As illustrated in FIG. 1B, the contact pad 120 of FIG. 1A may includeprocessing circuitry 125 for storing and processing information,including a microprocessor 130 and a memory 135. It is understood thatthe processing circuitry 125 may contain additional components,including processors, memories, error and parity/CRC checkers, dataencoders, anticollision algorithms, controllers, command decoders,security primitives and tamperproofing hardware, as necessary to performthe functions described herein.

The memory 135 may be a read-only memory, write-once read-multiplememory or read/write memory, e.g., RAM, ROM, and EEPROM, and the card100 may include one or more of these memories. A read-only memory may befactory programmable as read-only or one-time programmable. One-timeprogrammability provides the opportunity to write once then read manytimes. A write once/read-multiple memory may be programmed at a point intime after the memory chip has left the factory. Once the memory isprogrammed, it may not be rewritten, but it may be read many times. Aread/write memory may be programmed and re-programed many times afterleaving the factory. It may also be read many times.

The memory 135 may be configured to store one or more applets 140, oneor more counters 145, and a customer identifier 150. The one or moreapplets 140 may comprise one or more software applications configured toexecute on one or more cards, such as Java Card applet. However, it isunderstood that applets 140 are not limited to Java Card applets, andinstead may be any software application operable on cards or otherdevices having limited memory. The one or more counters 145 may comprisea numeric counter sufficient to store an integer. The customeridentifier 150 may comprise a unique alphanumeric identifier assigned toa user of the card 100, and the identifier may distinguish the user ofthe card from other card users. In some examples, the customeridentifier 150 may identify both a customer and an account assigned tothat customer and may further identify the card associated with thecustomer's account.

The processor and memory elements of the foregoing exemplary embodimentsare described with reference to the contact pad, but the presentdisclosure is not limited thereto. It is understood that these elementsmay be implemented outside of the pad 120 or entirely separate from it,or as further elements in addition to processor 130 and memory 135elements located within the contact pad 120.

In some examples, the card 100 may comprise one or more antennas 155.The one or more antennas 155 may be placed within the card 100 andaround the processing circuitry 125 of the contact pad 120. For example,the one or more antennas 155 may be integral with the processingcircuitry 125 and the one or more antennas 155 may be used with anexternal booster coil. As another example, the one or more antennas 155may be external to the contact pad 120 and the processing circuitry 125.

In an embodiment, the coil of card 100 may act as the secondary of anair core transformer. The terminal may communicate with the card 100 bycutting power or amplitude modulation. The card 100 may infer the datatransmitted from the terminal using the gaps in the card's powerconnection, which may be functionally maintained through one or morecapacitors. The card 100 may communicate back by switching a load on thecard's coil or load modulation. Load modulation may be detected in theterminal's coil through interference.

As illustrated in FIG. 2A, system 200 depicts various schematics of asurface of a contact pad and a chip. FIG. 2A may reference the same orsimilar components as illustrated in FIG. 1A and FIG. 1B, including thecard, chip and the contact pad. In some examples, the chip may comprisean integrated circuit. In one example, contact pad 205 may include aplanar surface 210 comprising a pad substrate 215 and a chip 220embedded, integrated, or otherwise in communication with contact pad 205via one or more electronic components or connections 225. For example,one or more connections 225 may comprise one or more leads, wires orpins, or any combination thereof, communicatively coupled to chip 220.One or more connections 225 may be configured to connect to a chipsurface 230 of the chip 220. As illustrated in FIG. 2A, the chip surface230 may comprise an exterior region of chip 220, and the chip 220 isshown as projecting outwards from card 205 to depict its connectivity.

As illustrated in FIG. 2B, the one or more connections 225, aspreviously depicted in FIG. 2A, are shown as being removed. FIG. 2B mayreference the same or similar components of contact pad 205 aspreviously described with reference to FIG. 2A. In some examples,removal of the one or more connections 225 may take place by one or morestructures 265, including but not limited to one or more of wirecutters, scissors, clippers, picks, pliers, pins, threads, needles,blades, knives, or any other structure, or any combination thereof,configured to remove the one or more connections 225.

As illustrated in FIG. 2C, the one or more connections 225, aspreviously depicted in FIG. 2B, have been severed due to the removal byone or more structures 265 as explained above with reference to FIG. 2B.FIG. 2C may reference the same or similar components of card 205 aspreviously described with reference to FIG. 2B.

FIG. 2D illustrates another example of a contact pad and a chip. Asshown in FIG. 2D, contact pad 235 includes a planar surface 240comprising a pad substrate 245 and a chip 250 embedded, integrated, orotherwise in communication with card 205 via one or more electroniccomponents or connections 255. For example, one or more connections 255may comprise one or more wires or pins, or any combination thereof,communicatively coupled to chip 250. One or more connections 255 may beconfigured to connect a surface 260 of the chip 250. As illustrated inFIG. 2D, surface 260 may comprise an interior region of chip 250, andthe chip 250 is shown as projecting outwards from card 205 to depict itsconnectivity. As further illustrated in FIG. 2D, one or more connections255 of card 235 have not yet been severed.

As illustrated in FIG. 2E, the one or more connections 255 of card 235,as previously depicted in FIG. 2D, are shown as being removed. FIG. 2Emay reference the same or similar components of card 235 as previouslydescribed with reference to FIG. 2D. In some examples, removal of theone or more leads 255 may take place by one or more structures 265,including but not limited to one or more of wire cutters, scissors,clippers, picks, pliers, pins, threads, needles, blades, knives, or anyother structure, or any combination thereof, configured to remove one ormore connections 255.

As illustrated in FIG. 2F, the one or more connections 255 of card 235,as previously depicted in FIG. 2E, have been severed due to the removalby one or more structures 265 as explained above with reference to FIG.2E. FIG. 2F may reference the same or similar components of card 235 aspreviously described with reference to FIG. 2E.

As illustrated in FIG. 3A, system 300 depicts a schematic ofcross-sectional view of a chip pocket of a card. FIG. 3A may referencethe same or similar components as illustrated in FIGS. 2A-2F, such as acard, one or more connections, and a chip. Card 305 may comprise a chip310 that is at least partially or wholly positioned on or at leastpartially or wholly encompassed or at least partially or whollyintegrated within a housing or reservoir, the housing or reservoircomprising a chip pocket 315. In some examples, the one or more peaksand one or more valleys 320 may comprise one or more air gaps. In someexamples, the one or more peaks and one or more valleys 320 may compriseone or more tapered or jagged edges. Although single instances of thechip 310 are depicted in FIG. 3A, one or more chips 310 of card 305 maybe at least partially or wholly positioned on or at least partially orwholly encompassed or at least partially or wholly integrated within oneor more housings or reservoirs.

In some examples, the one or more peaks and one or more valleys 320 ofthe chip pocket 315 may be generated or designed via a saw tooth millingpattern. The saw tooth milling pattern may be programmed or machined bya machine (not shown). In contrast to a smooth milling pattern, the sawtooth milling pattern for the chip pocket 315 or a derivation of the sawtooth milling pattern, makes it difficult to attempt removal and/orremove the chip 310 from the card 305. Thus, the saw tooth millingpattern promotes the success of adhesion of the chip 310 to the chippocket 315 while also creating an uneven cutting process to preventremoval of the chip 310. In addition, one or more adhesives may beapplied within the air gaps between the one or more peaks and one ormore valleys 320 (e.g., to completely or partially fill the air gaps),which may strengthen the adhesion of the chip 310 within the chip pocket315. As a consequence of this removal prevention design, removal of thechip may be more difficult and chip fraud may be reduced.

In some examples, each of the one or more peaks and one or more valleys320 of the chip pocket 315 may comprise same or different shapes,lengths, and/or dimensions so as to produce one or more arrangements ofthe one or more shapes. For example, although seven types of peaks andvalleys are illustrated in FIG. 3A, fewer or greater peaks and valleysmay be included, and other types of peaks and valleys 320 may compriseone or more angled and/or curved portions. Accordingly, one or morepeaks and one or more valleys 320 may comprise different or irregularshapes, lengths, and/or dimensions. In some examples, one or moresubsets of the one or more peaks and the one or more valleys 320 may begenerated or repeated after a predetermined interval, or one or moresubsets of the one or more peaks and one or more valleys 320 maygenerated or repeated at random, as determined by one or more machiningprocesses. Although FIG. 3A depicts the card 305, chip 310, one or moreconnections 320, and one or more peaks and one or more valleys 320,different variations may be used within a given card 305 issuance, suchthat the same card issued by an institution may have a number ofdifferent patterns based on the particular card 305 that is prepared forthe user. In the event the user misplaces their card 305, a new card maybe issued with an entirely different pattern to replace the previouscard.

FIG. 3B illustrates another example embodiment of the system 300 shownin FIG. 3A, including a card 305, a chip 310, a chip pocket 315, and oneor more peaks and one or more valleys 320 that may comprise one or moreair gaps. As shown in FIG. 3B, one or more connections 325, which maycomprise one or more leads, wires or pins, or any combination thereof,may be communicatively coupled to at least a portion of the chip 310.The one or more connection 325 may be disposed between the one or peaksand one or more valleys 320. In some examples, the one or moreconnections 325 may be disposed within air gaps between the one or peaksand one or more valleys 320. In other examples, the one or moreconnections 325 may be disposed within the adhesive that may completelyor partially fill the air gaps. In either case, if any of the one ormore connections 325 are severed during an attempt to remove the chip310, the chip 310 may not properly function. Accordingly, disposing theone or more leads between the one or peaks and one or more valleys 320may increase the difficulty of removing the chip and reduce thelikelihood that chip fraud may be committed.

As illustrated in FIG. 3C, system 300 depicts a schematic ofcross-sectional view of a chip pocket of a card. FIG. 3C may referencethe same or similar components as illustrated in FIGS. 3A-3B, such as acard, one or more connections, and a chip. Card 305 may comprise a chip310 that is at least partially or wholly positioned on or at leastpartially or wholly encompassed or at least partially or whollyintegrated within a housing or reservoir, the housing or reservoircomprising a chip pocket 315. In some examples, the one or more peaksand one or more valleys 320 may comprise one or more air gaps. In someexamples, the one or more peaks and one or more valleys 320 may compriseone or more tapered or jagged edges. Although single instances of thechip 310 are depicted in FIG. 3C, one or more chips 310 of card 305 maybe at least partially or wholly positioned on or at least partially orwholly encompassed or at least partially or wholly integrated within oneor more housings or reservoirs.

In some examples, the one or more peaks and one or more valleys 320 ofthe chip pocket 315 may be generated or designed via a saw tooth millingpattern. The saw tooth milling pattern may be programmed or machined bya machine (not shown). In contrast to a smooth milling pattern, the sawtooth milling pattern for the chip pocket 315 or a derivation of the sawtooth milling pattern, makes it difficult to attempt removal and/orremove the chip 310 from the card 305. Thus, the saw tooth millingpattern promotes the success of adhesion of the chip 310 to the chippocket 315 while also creating an uneven cutting process to preventremoval of the chip 310. In addition, one or more adhesives may beapplied within the air gaps between the one or more peaks and one ormore valleys 320 (e.g., to completely or partially fill the air gaps),which may strengthen the adhesion of the chip 310 within the chip pocket315. As a consequence of this removal prevention design, removal of thechip may be more difficult and chip fraud may be reduced.

In some examples, each of the one or more peaks and one or more valleys320 of the chip pocket 315 may comprise same or different shapes,lengths, and/or dimensions so as to produce one or more arrangements ofthe one or more shapes. For example, although three peaks and fourvalleys are illustrated in FIG. 3C, fewer or greater peaks and valleysmay be included, and other types of peaks and valleys 320 may compriseone or more angled and/or curved portions. Accordingly, one or morepeaks and one or more valleys 320 may comprise different or irregularshapes, lengths, and/or dimensions. In some examples, one or moresubsets of the one or more peaks and the one or more valleys 320 may begenerated or repeated after a predetermined interval, or one or moresubsets of the one or more peaks and one or more valleys 320 maygenerated or repeated at random, as determined by one or more machiningprocesses. Although FIG. 3C depicts the card 305, chip 310, one or moreconnections 320, and one or more peaks and one or more valleys 320,different variations may be used within a given card 305 issuance, suchthat the same card issued by an institution may have a number ofdifferent patterns based on the particular card 305 that is prepared forthe user. In the event the user misplaces their card 305, a new card maybe issued with an entirely different pattern to replace the previouscard.

FIG. 3D illustrates another example embodiment of the system 300 shownin FIG. 3C, including a card 305, a chip 310, a chip pocket 315, and oneor more peaks and one or more valleys 320 that may comprise one or moreair gaps. As shown in FIG. 3D, one or more connections 325, which maycomprise one or more leads, wires or pins, or any combination thereof,may be communicatively coupled to at least a portion of the chip 310.The one or more connection 325 may be disposed between the one or peaksand one or more valleys 320. In some examples, the one or moreconnections 325 may be disposed within air gaps between the one or peaksand one or more valleys 320. In other examples, the one or moreconnections 325 may be disposed within the adhesive that may completelyor partially fill the air gaps. In either case, if any of the one ormore connections 325 are severed during an attempt to remove the chip310, the chip 310 may not properly function. Accordingly, disposing theone or more leads between the one or peaks and one or more valleys 320may increase the difficulty of removing the chip and reduce thelikelihood that chip fraud may be committed.

As illustrated in FIG. 3E, system 300 depicts a schematic ofcross-sectional view of a chip pocket of a card. FIG. 3E may referencethe same or similar components as illustrated in FIGS. 3A-3D, such as acard, one or more connections, and a chip. Card 305 may comprise a chip310 that is at least partially or wholly positioned on or at leastpartially or wholly encompassed or at least partially or whollyintegrated within a housing or reservoir, the housing or reservoircomprising a chip pocket 315. In some examples, the one or more peaksand one or more valleys 320 may comprise one or more air gaps. In someexamples, the one or more peaks and one or more valleys 320 may compriseone or more tapered or jagged edges. Although single instances of thechip 310 are depicted in FIG. 3E, one or more chips 310 of card 305 maybe at least partially or wholly positioned on or at least partially orwholly encompassed or at least partially or wholly integrated within oneor more housings or reservoirs.

In some examples, the one or more peaks and one or more valleys 320 ofthe chip pocket 315 may be generated or designed via a saw tooth millingpattern. The saw tooth milling pattern may be programmed or machined bya machine (not shown). In contrast to a smooth milling pattern, the sawtooth milling pattern for the chip pocket 315 or a derivation of the sawtooth milling pattern, makes it difficult to attempt removal and/orremove the chip 310 from the card 305. Thus, the saw tooth millingpattern promotes the success of adhesion of the chip 310 to the chippocket 315 while also creating an uneven cutting process to preventremoval of the chip 310. In addition, one or more adhesives may beapplied within the air gaps between the one or more peaks and one ormore valleys 320 (e.g., to completely or partially fill the air gaps),which may strengthen the adhesion of the chip 310 within the chip pocket315. As a consequence of this removal prevention design, removal of thechip may be more difficult and chip fraud may be reduced.

In some examples, each of the one or more peaks and one or more valleys320 of the chip pocket 315 may comprise same or different shapes,lengths, and/or dimensions so as to produce one or more arrangements ofthe one or more shapes. For example, although three peaks and fourvalleys are illustrated in FIG. 3E, fewer or greater peaks and valleysmay be included, and other types of peaks and valleys 320 may compriseone or more angled and/or curved portions. Accordingly, one or morepeaks and one or more valleys 320 may comprise different or irregularshapes, lengths, and/or dimensions. In some examples, one or moresubsets of the one or more peaks and the one or more valleys 320 may begenerated or repeated after a predetermined interval, or one or moresubsets of the one or more peaks and one or more valleys 320 maygenerated or repeated at random, as determined by one or more machiningprocesses. Although FIG. 3E depicts the card 305, chip 310, one or moreconnections 320, and one or more peaks and one or more valleys 320,different variations may be used within a given card 305 issuance, suchthat the same card issued by an institution may have a number ofdifferent patterns based on the particular card 305 that is prepared forthe user. In the event the user misplaces their card 305, a new card maybe issued with an entirely different pattern to replace the previouscard.

FIG. 3F illustrates another example embodiment of the system 300 shownin FIG. 3E, including a card 305, a chip 310, a chip pocket 315, and oneor more peaks and one or more valleys 320 that may comprise one or moreair gaps. As shown in FIG. 3F, one or more connections 325, which maycomprise one or more leads, wires or pins, or any combination thereof,may be communicatively coupled to at least a portion of the chip 310. Insome examples, the one or more connections 325 may be disposed withinair gaps between the one or peaks and one or more valleys 320. In otherexamples, the one or more connections 325 may be disposed within theadhesive that may completely or partially fill the air gaps. In eithercase, if any of the one or more connections 325 are severed during anattempt to remove the chip 310, the chip 310 may not properly function.Accordingly, disposing the one or more leads between the one or peaksand one or more valleys 320 may increase the difficulty of removing thechip and reduce the likelihood that chip fraud may be committed.

As illustrated in FIG. 3G, system 300 depicts a schematic ofcross-sectional view of a chip pocket of a card. FIG. 3G may referencethe same or similar components as illustrated in FIGS. 3A-3F, such as acard, one or more connections, and a chip. Card 305 may comprise a chip310 that is at least partially or wholly positioned on or at leastpartially or wholly encompassed or at least partially or whollyintegrated within a housing or reservoir, the housing or reservoircomprising a chip pocket 315. In some examples, the one or more peaksand one or more valleys 320 may comprise one or more air gaps. In someexamples, the one or more peaks and one or more valleys 320 may compriseone or more tapered or jagged edges. Although single instances of thechip 310 are depicted in FIG. 3G, one or more chips 310 of card 305 maybe at least partially or wholly positioned on or at least partially orwholly encompassed or at least partially or wholly integrated within oneor more housings or reservoirs.

In some examples, the one or more peaks and one or more valleys 320 ofthe chip pocket 315 may be generated or designed via a saw tooth millingpattern. The saw tooth milling pattern may be programmed or machined bya machine (not shown). In contrast to a smooth milling pattern, the sawtooth milling pattern for the chip pocket 315 or a derivation of the sawtooth milling pattern, makes it difficult to attempt removal and/orremove the chip 310 from the card 305. Thus, the saw tooth millingpattern promotes the success of adhesion of the chip 310 to the chippocket 315 while also creating an uneven cutting process to preventremoval of the chip 310. In addition, one or more adhesives may beapplied within the air gaps between the one or more peaks and one ormore valleys 320 (e.g., to completely or partially fill the air gaps),which may strengthen the adhesion of the chip 310 within the chip pocket315. As a consequence of this removal prevention design, removal of thechip may be more difficult and chip fraud may be reduced.

In some examples, each of the one or more peaks and one or more valleys320 of the chip pocket 315 may comprise same or different shapes,lengths, and/or dimensions so as to produce one or more arrangements ofthe one or more shapes. For example, although two peaks and threevalleys are illustrated in FIG. 3G, fewer or greater peaks and valleysmay be included, and other types of peaks and valleys 320 may compriseone or more angled and/or curved portions. Accordingly, one or morepeaks and one or more valleys 320 may comprise different or irregularshapes, lengths, and/or dimensions. In some examples, one or moresubsets of the one or more peaks and the one or more valleys 320 may begenerated or repeated after a predetermined interval, or one or moresubsets of the one or more peaks and one or more valleys 320 maygenerated or repeated at random, as determined by one or more machiningprocesses. Although FIG. 3G depicts the card 305, chip 310, one or moreconnections 320, and one or more peaks and one or more valleys 320,different variations may be used within a given card 305 issuance, suchthat the same card issued by an institution may have a number ofdifferent patterns based on the particular card 305 that is prepared forthe user. In the event the user misplaces their card 305, a new card maybe issued with an entirely different pattern to replace the previouscard.

FIG. 3H illustrates another example embodiment of the system 300 shownin FIG. 3H, including a card 305, a chip 310, a chip pocket 315, and oneor more peaks and one or more valleys 320 that may comprise one or moreair gaps. As shown in FIG. 3H, one or more connections 325, which maycomprise one or more leads, wires or pins, or any combination thereof,may be communicatively coupled to at least a portion of the chip 310. Insome examples, the one or more connections 325 may be disposed withinair gaps between the one or peaks and one or more valleys 320. In otherexamples, the one or more connections 325 may be disposed within theadhesive that may completely or partially fill the air gaps. In eithercase, if any of the one or more connections 325 are severed during anattempt to remove the chip 310, the chip 310 may not properly function.Accordingly, disposing the one or more connections 325 between the oneor peaks and one or more valleys 320 may increase the difficulty ofremoving the chip and reduce the likelihood that chip fraud may becommitted.

FIG. 4A illustrates a system 400 according to an example embodiment.FIG. 4A depicts a schematic of cross-sectional view of a chip pocket ofa card. FIG. 4A may reference same or similar components as illustratedin FIGS. 1-3D, such as a card, one or more connections, and a chip. Card405 may comprise a chip 410 that is at least partially or whollypositioned on or at least partially or wholly encompassed or at leastpartially or wholly integrated within a housing or reservoir, thehousing or reservoir comprising a chip pocket 415. FIG. 4A depicts afraud prevention capacitance member 430. Capacitance member 430 may beat least partially or wholly disposed within the chip pocket 415. One ormore connections 420 may be communicatively coupled to at least aportion, such as a surface, of the chip 410. Although single instancesof the chip 410 and capacitance member 430 are depicted in FIG. 4A, oneor more chips 410 or capacitance members 430 of card 405 may be at leastpartially or wholly positioned on or at least partially or whollyencompassed or at least partially or wholly integrated within one ormore housings or reservoirs.

Capacitance members 430 may comprise any material with a measureableand/or detectable capacitance value. In some embodiments, capacitancemember 430 comprises a metal and/or metal alloy. It will be appreciatedthat the capacitance value associated with a capacitance member 430depends, at least in part on the materials of the capacitance member430.

Capacitance member 430 may be any dimensions or form-factor. In someembodiments, capacitance member may comprise one or more wires, coils,plates, discs, cubes, particles, flakes, and/or combinations thereof. Itwill be appreciated that the capacitance value associated with acapacitance member 430 depends, at least in part, on the dimensions andconfiguration of the capacitance member 430.

In some embodiments, chip 410 comprises a memory containing an applet.The capacitance member 430 may be in data communication with the chip415 and the applet may be configured to measure or determine acapacitance value of the capacitance member 430. In some embodiments,the applet measures the capacitance value of the capacitance member 430prior to performing an operation such as, for example, authorizing atransaction.

Each capacitance member 430 comprises a capacitance value based on thematerials, dimensions, and configuration of the capacitance member. Ifthe chip 410 is separated from the capacitance member 430 the applet isable to detect this separation. The capacitance value of the capacitancemember 430 may be measured with a high degree of precision such thatduplicating a capacitance member with the same capacitance value ispresents a significant challenge.

In some embodiments, when a chip 410 is initially activated, the chip410 may detect the initial capacitance value of the capacitance member430 to which the chip 410 is initially connected. The chip and/or anapplet contained within a memory on the chip, may then be configured tomeasure the capacitance value of the capacitance member 430 prior toauthorizing operations. This arrangement allows for a chip 410 to bemarried to a specific capacitance member 430 when the chip is initiallyactivated. The chip 410 may also be configured to deny operations and/orissue a fraud alert if the chip 410 is ever removed from the specificcapacitance member 430 to which the chip 410 is initially married.

FIG. 4B illustrates a system 400 according to an example embodiment.FIG. 4B depicts a schematic of cross-sectional view of a chip pocket ofa card. FIG. 4B may reference same or similar components as illustratedin FIGS. 1-4A, such as a card, one or more connections, and a chip.

As depicted in FIG. 4B, in some embodiments, the chip 410 may be in datacommunication with the capacitance member 430 through one or moreconnections 420. In some embodiments, the capacitance member 430 may bearranged to be separated from the chip upon contact with a structureconfigured to remove one or more connections 420. If a fraudsterattempts to remove the chip 410 from the card 405, the fraudster islikely to damage or break a connection 420 that is necessary for theapplet to measure the capacitive value of the capacitive member 430. Ifthe applet is unable to measure the capacitive value of the capacitivemember 430, the applet may deny any future transactions.

FIG. 4C illustrates a system 400 according to an example embodiment.FIG. 4C depicts a schematic of cross-sectional view of a chip pocket ofa card. FIG. 4C may reference same or similar components as illustratedin FIGS. 1-4B, such as a card, one or more connections, and a chip.

As depicted in FIG. 4C, in some embodiments, the capacitive member 430is a wire. In some embodiments, a first end of the capacitance wire maybe in communication with is in data communication with the chip. In someembodiments, a second end of the capacitance wire may be secured withinthe chip pocket. If a second end of the capacitance wire is securedwithin the chip pocket, a fraudster will face significant challengeswhen attempting to remove the chip and/or capacitance wire withoutdamaging or altering the capacitance of the capacitance wire.Additionally, the capacitance wire will be difficult or impossible toinstall in a different card without altering the capacitance value ofthe capacitance wire. If the applet detects a chance in the capacitancevalue of the capacitance wire, the applet may be configured to issue afraud notification.

FIG. 4D illustrates a system 400 according to an example embodiment.FIG. 4D depicts a schematic of cross-sectional view of a chip pocket ofa card. FIG. 4D may reference same or similar components as illustratedin FIGS. 1-4C, such as a card, one or more connections, and a chip.

As depicted in FIG. 4D, in some embodiments, the capacitive member 430is a coil. In some embodiments, a first end of the capacitance coil maybe in communication with is in data communication with the chip. In someembodiments, a second end of the capacitance coil may be secured withinthe chip pocket, thereby making removal of the chip and/or capacitivecoil difficult without altering the capacitive value of the capacitivecoil.

In some embodiments, the capacitive coil may be a spring that isconfigured to apply a force to the surface of the chip. A capacitivecoil or capacitive spring may be compressed when the capacitive coil orspring is initially installed. The initial capacitive value determinedby the chip may reflect the degree and/or nature of compression of thecapacitive coil or spring.

In some embodiments, the capacitive spring may apply a force to the chipand/or chip pocket. The chip may be secured in place, thereby containingthe compressed capacitive spring, using an adhesive. In suchembodiments, if the adhesive securing the chip to the card is damaged,the compressed capacitive spring my force the chip away from the card ina manner that is designed to damage one or more connections orcapacitive members. In such embodiments, an attempt to remove a chipfrom a card would likely result in damage to the chip, connections,and/or capacitive members. An applet contained within the memory of thechip may be configured to issue a fraud notice if it detects damage toany connections or changes to a capacitive member.

FIG. 5 illustrates a method 500 of making a card. FIG. 5 may referencethe same or similar components of FIGS. 1-4, as explained above.

At block 510, method may comprise laminating one or more layerstogether. In some examples, the one or more layers may comprise anoutermost or exterior layer which includes a layer that receives paint,ink, or laser treatment. The outermost or exterior layer may comprisethe ceiling or top layer of the one or more laminated layers. Theoutermost or exterior layer may comprise a thin film that receives laserpersonalization. In some examples, the laser personalization maycomprise custom laser personalization.

The one or more layers may further comprise one or more artwork layerspositioned below the outermost or exterior layer. For example, the oneor more artwork layers may comprise personalized information about theuser and/or financial institution that issues the card.

The one or more layers may further comprise one or more metal corelayers positioned below the one or more artwork layers.

The one or more layers may comprise one or more magnetic stripe layerpositioned below the one or more metal core layers. In some examples,the one or more magnetic stripe layers may comprise the innermost orinterior layer of the card.

In some examples, the one or more layers may be arranged in one or moresheets. By way of an example, each sheet may comprise a plurality ofcards. In some examples, one or more sheets may comprise 50 or morecards. The one or more sheets may be fed to a laminating press which isconfigured to laminate the one or more layers together. In someexamples, the lamination process may comprise hot lamination or coldlamination. At this point, the card includes the one or more layers, anddoes not yet include personal information, a signature panel, ahologram, and a chip.

At block 520, a hologram may be placed on the card. In some examples,the hologram may comprise a secure hologram, and the hologram may beplaced on an area of the card. In some examples, the hologram may beplaced on a secure area of the card that may be checked by a merchant.

At block 530, a signature panel may be placed on the card. In someexamples, the signature panel may be heat stamped onto a portion thecard. The signature panel may also be checked by a merchant. Thesignature panel may be placed on a portion of the card, such as the backof the card.

At block 540, the card may be transferred to one or more machines. Theone or more machines may comprise a stamping machine and may beconfigured to mill one or more chip pockets and embed a chip into thecard. In some examples, the card may comprise a chip that is at leastpartially or wholly positioned on or at least partially or whollyencompassed or at least partially or wholly integrated within a housingor reservoir, the housing or reservoir comprising a chip pocket. Asfurther discussed below, one or more connections may communicativelycouple at least a portion, such as a surface, of the chip which may beat least partially or wholly disposed on one or more peaks and one ormore valleys of the chip pocket. In some examples, the one or more peaksand one or more valleys may comprise one or more air gaps. In someexamples, the one or more peaks and one or more valleys may comprise oneor more tapered or jagged edges.

In some examples, the one or more peaks and one or more valleys of thechip pocket may be generated or designed via a saw tooth millingpattern. The saw tooth milling pattern may be programmed or machined bya machine. In contrast to a smooth milling pattern, the saw toothmilling pattern for the chip pocket and one or more connections, or aderivation of the saw tooth milling pattern, makes it difficult toattempt removal and/or remove the chip from the card. Thus, the sawtooth milling pattern promotes the success of adhesion of the chip tothe chip pocket while also creating an uneven cutting process to preventremoval of the chip. As a consequence of this removal prevention design,chip fraud is eliminated.

In some examples, each of the one or more peaks and one or more valleysof the chip pocket may comprise same or different shapes, lengths,and/or dimensions so as to produce one or more arrangements of the oneor more shapes. Accordingly, one or more connections may comprisedifferent or irregular shapes, lengths, and/or dimensions. In someexamples, one or more subsets of the one or more peaks and the one ormore valleys may be generated or repeated after a predeterminedinterval, or one or more subsets of the one or more peaks and one ormore valleys may generated or repeated at random, as determined by oneor more machining processes. For example, one or more peaks and one ormore valleys may be included, and other types of peaks and valleys maycomprise one or more angled and/or curved portions. Different variationsmay be used within a given card issuance, such that the same card issuedby an institution may have a number of different patterns based on theparticular card that is prepared for the user. In the event the usermisplaces their card, a new card may be issued with an entirelydifferent pattern to replace the previous card.

In some examples, the chip may comprise an integrated circuit. In oneexample, card may include a planar surface comprising a substrate, and achip embedded or integrated or otherwise in communication with card viaone or more electronic components or connections. For example, the oneor more connections may comprise one or more leads, wires or pins, orany combination thereof, communicatively coupled to chip. One or moreconnections may be configured to connect a surface of the chip. Thesurface may comprise an exterior region of chip, and the chip mayproject outwards from card to depict its connectivity.

In another example, the card may include a chip embedded or integratedor otherwise in communication with card via one or more electroniccomponents or connections. For example, one or more connections maycomprise one or more wires or pins, or any combination thereof,communicatively coupled to chip. One or more connections may beconfigured to connect a surface of the chip. The surface may comprise aninterior region of chip, and the chip may be project outwards from thecard to depict its connectivity.

At block 550, after the one or more chip pockets are created for housingthe chip, the one or more machines may be configured to punch the chipinto the one or more chip pockets. In some examples, other machines maybe used in lieu of the stamping machine to punch the chip into the oneor more chip pockets.

At block 560, the chip may include MasterCard or Visa information. Atthis point, no other information exists within the chip, such as cardinformation or to whom the card is assigned to. The card may beassociated with one or more card identifiers. In some examples, the oneor more card identifiers may be printed adjacent to a corner of thecard; however, other regions of the card may be used for display of theone or more card identifiers.

At block 570, the card may be sent to a vault or facility, such as apersonalization facility, and the card is ready for pick up. One or moremachines within the vault or facility may request the card based on theone or more card identifiers. The one or more machines may receive thecard based on the one or more card identifiers and may perform encodingof the magnetic stripe; printing of data, such as account numberinformation and user information, including first and last name, on thefront and/or back of the card; encoding of the chip. For example, thecard may comprise identification information displayed on the frontand/or back of the card, and a contact pad. In some examples, theidentification information may comprise one or more of cardholder nameand expiration date of the card. The card may also include a magneticstripe or tape, which may be located on the back of the card.

FIG. 6 illustrates a method 600 of making a card. FIG. 6 may referencesame or similar components of FIGS. 1-5, as explained above.

At block 610, method 600 may comprise positioning a chip of a device ina reservoir. The chip may comprise a memory containing an applet. Thechip may be secured and/or adhered in position after it is originallypositioned within the reservoir. Additionally, any connections orcapacitance members may be secured to the reservoir or surface of thechip prior to securing the chip in place.

At block 620, method 600 comprises coupling a component, such as anelectrical connection or wire to the surface of the chip. In embodimentsin which the chip is positioned under a contact pad, the components mayprovide data communication between the contact pad and the chip. In someembodiments, the components may be coupled to the lower surface of thechip and secured within the reservoir.

At block 630, method 600 comprises coupling a capacitance member to thesurface of the chip. The capacitance member may be one or more wires,coils, plates, discs, cubes, particles, flakes, and/or combinationsthereof. In some embodiments, a capacitive plate may be coupled to thechip using a connection. In some embodiments, the capacitive member maybe coupled to the chip using an electrically conductive adhesive.

At block 640, method 600 comprises measuring an initial capacitancevalue of the capacitance member. In some embodiments, the chip comprisesa memory containing an applet. The applet may be configured to measurean initial capacitance value of the capacitance member as the precisecapacitance value of the capacitance member may be difficult todetermine prior to coupling the capacitance member to the chip.Additionally, the capacitance value of some capacitance members maychange as the chip is positioned and/or secured within the reservoir.Once the chip and capacitance member are in their finishedconfigurations, the applet may measure an initial capacitance value anduse that value as a baseline for subsequent measurements to detectfraudulent activity.

At step 650, method 600 comprises measuring a subsequent capacitancevalue of the capacitance member. At step 660, method 600 comprisescomparing the initial capacitance value and the subsequent capacitancevalue. The applet may be configured to compare the initial andsubsequent capacitance values to detect fraudulent activity. In someembodiments, the applet may be configured to disregard a difference ofcapacitance values that is within a predetermined amount as thecapacitance value of the capacitance member may change slightly if thedevice, such as, for example, a card, containing the chip andcapacitance member is flexed during normal use. In some embodiments, theapplet may be configured to update a baseline capacitance value is thesubsequently measured capacitance values continuously changes in steadyfashion over time. In some embodiments, this may indicate normalwear-and-tear rather than fraudulent activity.

At step 670, method 600 comprises issuing a fraud alert based on adetermined difference between a subsequently measured capacitance valueand the initially measured capacitance value or a baseline capacitancevalue. If the applet determines a change in capacitance value greaterthan a predetermined acceptable amount, the applet may determine thatfraudulent activity has occurred such as, for example, a fraudsterattempting to remove the chip from a card.

In some embodiments, the chip and/or reservoir may comprise one or moreshape such as, for example, peaks and/or valleys, formed in a saw toothmilling pattern. In some examples, the components, connections andcapacitance members coupled or otherwise secured to the chip may beplaced between the peaks or valleys to further frustrate any attempt toremove a chip from a card without damaging the capacitance member orother components and triggering a fraud alert.

FIG. 7 illustrates a schematic of one or more layers of the card 700.FIG. 7 may reference the same or similar components of FIGS. 1-6 asexplained above.

Card 700 may comprise one or more layers that are laminated together.Although single instances of each layer are depicted in FIG. 7, card 700may include one or more layers for each layer. In some examples, thecard 700 may comprise a first layer 710, such as an outermost orexterior layer which includes a layer that receives paint, ink, or lasertreatment. The outermost or exterior layer may comprise the ceiling ortop layer of the one or more laminated layers. The outermost or exteriorlayer may comprise a thin film that receives laser personalization. Insome examples, the laser personalization may comprise custom laserpersonalization.

Card 700 may further comprise a second layer, including one or moreartwork layers 720 positioned below the outermost or exterior layer 710.For example, the one or more artwork layers 720 may comprisepersonalized information about the user and/or financial institutionthat issues the card 700.

Card 700 may further comprise a third layer 730, including one or moremetal core layers positioned below the one or more artwork layers 720.

Card 700 may further comprise a fourth layer 740, including one or moremagnetic stripe layer positioned below the one or more metal core layers730. In some examples, the one or more magnetic stripe layers 740 maycomprise the innermost or interior layer of the card 700.

As used herein, the terms “card,” “contactless card,” and “smartcard”are not limited to a particular type of card. Rather, it is understoodthat these terms can refer to a contact-based card, a contactless card,or any other card including a chip. It is further understood that thecard may be any type of card containing a chip, including withoutlimitation an identity card, a membership card, a loyalty card, anaccess card, a security card, and a badge.

Exemplary embodiments described herein relate to chips used insmartcards, however, the present disclosure is not limited thereto. Itis understood that the present disclosure encompasses chips that may beused in a variety of devices that include electronic components havingchips, including without limitation computing devices (e.g., laptopcomputers, desktop computers, and servers), vehicles (e.g., automobiles,airplanes, trains, and ships), appliances (e.g., televisions,refrigerators, air conditions, furnaces, microwaves, dish washers, smokedetectors, thermostats, and lights), mobile devices (e.g., smartphonesand tablets), and wearable devices (e.g., smartwatches).

Throughout the specification and the claims, the following terms take atleast the meanings explicitly associated herein, unless the contextclearly dictates otherwise. The term “or” is intended to mean aninclusive “or.” Further, the terms “a,” “an,” and “the” are intended tomean one or more unless specified otherwise or clear from the context tobe directed to a singular form.

In this description, numerous specific details have been set forth. Itis to be understood, however, that implementations of the disclosedtechnology may be practiced without these specific details. In otherinstances, well-known methods, structures and techniques have not beenshown in detail in order not to obscure an understanding of thisdescription. References to “some examples,” “other examples,” “oneexample,” “an example,” “various examples,” “one embodiment,” “anembodiment,” “some embodiments,” “example embodiment,” “variousembodiments,” “one implementation,” “an implementation,” “exampleimplementation,” “various implementations,” “some implementations,”etc., indicate that the implementation(s) of the disclosed technology sodescribed may include a particular feature, structure, orcharacteristic, but not every implementation necessarily includes theparticular feature, structure, or characteristic. Further, repeated useof the phrases “in one example,” “in one embodiment,” or “in oneimplementation” does not necessarily refer to the same example,embodiment, or implementation, although it may.

As used herein, unless otherwise specified the use of the ordinaladjectives “first,” “second,” “third,” etc., to describe a commonobject, merely indicate that different instances of like objects arebeing referred to, and are not intended to imply that the objects sodescribed must be in a given sequence, either temporally, spatially, inranking, or in any other manner.

While certain implementations of the disclosed technology have beendescribed in connection with what is presently considered to be the mostpractical and various implementations, it is to be understood that thedisclosed technology is not to be limited to the disclosedimplementations, but on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the scope ofthe appended claims. Although specific terms are employed herein, theyare used in a generic and descriptive sense only and not for purposes oflimitation.

This written description uses examples to disclose certainimplementations of the disclosed technology, including the best mode,and also to enable any person skilled in the art to practice certainimplementations of the disclosed technology, including making and usingany devices or systems and performing any incorporated methods. Thepatentable scope of certain implementations of the disclosed technologyis defined in the claims, and may include other examples that occur tothose skilled in the art. Such other examples are intended to be withinthe scope of the claims if they have structural elements that do notdiffer from the literal language of the claims, or if they includeequivalent structural elements with insubstantial differences from theliteral language of the claims.

What is claimed is:
 1. A chip fraud prevention system comprising: adevice including a chip comprising a memory containing an applet, thechip at least partially encompassed in a chip pocket; one or moreconnections communicatively coupled to one or more surfaces of the chip;and a capacitance member coupled to a surface of the chip, wherein: thecapacitance member comprises a known capacitance value, the applet isconfigured to measure the capacitance value of the capacitance member,and the capacitance member comprises a spring, the spring having a firstend in data communication with the chip and configured to apply a forceto a surface of the chip.
 2. The chip fraud prevention system of claim1, wherein the applet is configured to detect a change in thecapacitance value of the capacitance member.
 3. The chip fraudprevention system of claim 2, wherein the applet is configured to issuea fraud notification upon detecting a change in the capacitance value ofthe capacitance member.
 4. The chip fraud prevention system of claim 1,wherein the capacitance member comprises a capacitance wire, a first endof the capacitance wire in data communication with the chip and a secondend of the capacitance wire secured within the chip pocket.
 5. The chipfraud prevention system of claim 1, wherein the capacitance value is atleast partially based on the length of the capacitance member.
 6. Thechip fraud prevention system of claim 1, wherein the spring is a conicalcompression spring.
 7. The chip fraud prevention system of claim 1,further comprising a contact pad, wherein one or more or the one or moreconnections are communicatively coupled to the contact pad.
 8. The chipfraud prevention system of claim 1, wherein the chip and capacitancemember are adhesively secured within the chip pocket.
 9. The chip fraudprevention system of claim 8, wherein the first end is securelyconnected to the chip using an electrically conductive adhesive.
 10. Thechip fraud prevention system of claim 1, wherein the device comprises acontactless card.
 11. The chip fraud prevention system of claim 1,wherein the chip comprises an integrated circuit.
 12. A method ofpreventing chip fraud, the method comprising the steps of: positioning achip of a device in a reservoir, the chip comprising a memory containingan applet; communicatively coupling one or more components to a surfaceof the chip; and coupling a capacitance member to the surface of thechip, wherein: the capacitance member comprises a capacitance value, thecapacitance member comprises a spring having a first end in datacommunication with the chip and configured to apply a force to a surfaceof the chip, and the applet is configured to detect the capacitancevalue of the capacitance member.
 13. The method of preventing chip fraudof claim 12, further comprising the applet: measuring the initialcapacitance value of the capacitance member; periodically measuring thecapacitance value of the capacitance member; comparing a measuredcapacitance value of the capacitance member to the initial capacitancevalue to detect a change in the capacitance value; and issuing a fraudalert upon detecting a change in the capacitance value greater than apredetermined amount.
 14. The method of preventing chip fraud of claim12, wherein the reservoir comprises one or more shapes, the one or moreshapes comprising one or more peaks and one or more valleys formed in asaw tooth milling pattern.
 15. The method of preventing chip fraud ofclaim 14, wherein the capacitance member is placed between the at leastone of the one or more peaks or one or more valleys, or any combinationthereof.
 16. The method of preventing chip fraud of claim 12, whereinthe spring comprises a capacitance wire comprising the first end and asecond end, the method further comprising securing the second end of thecapacitance wire within the reservoir.
 17. A contactless card includinga substrate layer, the contactless card comprising: one or moreintegrated circuits positioned in one or more housings; one or moreconnections communicatively coupled to one or more surfaces of each ofthe one or more integrated circuits, and one or more capacitance memberscommunicatively coupled to one or more surfaces of each of the one ormore integrated circuits, wherein: the one or more capacitance memberscomprise a known capacitance value based on the length and metal alloyof the capacitance members, the one or more capacitance members comprisea one or more springs, the one or more springs having one or more firstends in data communication with the one or more surfaces of each of theone or more integrated circuits and configured to apply a force to theone or more surfaces.